The Nanoquest I Load-Lock Ion Beam Etching System is an ideal platform for etching single wafer substrates up to 4". Configured with a high cooling flow substrate stage, the system can etch through a photo resist mask to produce patterned substrates on any material. We can keep your substrate below 50 deg C with high beam current densities. Direct water cooling is achived using two hollow shaft ferro fluid feedthrough, and motion is acomplished with stepper motors for rotation and tilt.
Vertical load-lock design keeps the chamber under high vacuum and reduces cycle times. A unique transfer assist controls the movement of the wafer transfer and prevent mishandling. The system is housed in a compact one-piece frame with integral electronics rack to minimize lab or clean room space. UHP Gas distribution ensures stable ion source operation.
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