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Nanochrome® I R&D Load Lock

The Nanochrome I is capable of multi-layer electron beam evaporation, magnetron sputtering, and ion beam etching all during the same pump down cycle
Intlvac’s Nanochrome I R&D Load Lock system is capable of evaporating materials such as metals and dielectrics by Electron Beam Evaporation from a four pocket electron beam gun, onto a direct water cooled rotating substrate stage.  The stage angle adjustment allows the system to be used for multi-layer electron beam evaporation, magnetron sputtering, and ion beam etching all during the same pump down cycle.

 

Inside the Nanochrome I Physical Vapor Deposition System The system provides a very high level of controlled, safe evaporation for materials through manual operation or closed loop control system.  Pump down operation is fully automated by Intlvac’s “Syscon” controller.

Thermal radiation shields and material deposition shields allow for the system to operate within a very large range of temperatures.  The system achieves base pressures in the low 10-8 torr by using a combination of all dry vacuum pumps.