|
Nanoquest II Batch
Designed for clean room operation, the Nanoquest II keeps the etch module in the service
area of the clean room. System components, such as shields and other serviceable items,
are easily accessed in the service area. A double door etch module allows servicing from
either side of the chamber. UHV design rules ensure that the etch module achieves very
low base pressures. High speed vacuum pumps not only provide a fast
pump down, but also reduce ion beam gas collisions.
Intlvac's Nanoquest II Ion Beam Etching System combines a water-cooled, rotating stage,
a 22cm RF ion source, an easily accessible stainless steel vacuum chamber, cryogenic high
vacuum pumping system, automatic pump down and venting, atmosphere to high vacuum gauging,
mass flow controllers, chamber cabinet, and electronic control console.
System Configuration and Layout
The vacuum chamber is constructed using only stainless steel and UHV fabrication techniques
with an electro-polished outer surface for a clean and attractive appearance. The vacuum chamber
has hinged front and rear doors for easy access and multiple view-ports for complete process
observation, including one view-port for the optional load lock.
High Performance
The Nanoquest comes supplied with 150mm and 100mm wafer platens for batch loading configuration
with carbon masks for smaller sized wafers. With uniformity of ± 3% over a 100mm diameter, and
a repeatability of ± 2% wafer to wafer, the Nanoquest is the ideal platform for your process.
|