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Nanoquest III Ion Mill

Nanoquest III Ion Mill The Nanoquest III Batch Ion Beam Etching System is one of the most economical and versatile production ion beam etch system on the market today. The system allows precise control of ion beam energy, and etch angle automatically. Designed as a production etch tool, the Nanoquest III is capable of performing processes ranging from simple inert etch to complex reactive operation.

The system utilizes double axis substrate roation and substrate offset to achieve highly uniform etches. The use of 5 hollow shaft rotary drives brings water cooling directly underneath each of the double rotating wafer planets.

The Nanoquest III system combines the water-cooled double axis stage with a 22 cm ion beam from a RF ion source. The easily accessible stainless steel vacuum chamber, features a completelly oil free high vacuum pumping system. System operation and display is thorugh Intlvac's graphical display running under LabVIEW.

Nanoquest III Ion Mill water-cooled, multi-wafer substrate stage Nanoquest III Ion Mill provides total control over your ion beam etching process Nanoquest III Ion Mill's double axis substrate roation and substrate offset achieves highly uniform etches

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The vacuum chamber is a 24” diameter × 25.5” deep horizontal stainless steel cylinder. Ultra-high vacuum compatible fabricating techniques are used throughout construction, with continuous internal welds on all flanges and ports. The internal chamber surface is mechanically ground and electro-polished to eliminate virtual vacuum leaks.

The outer surface is electro polished for a clean and attractive appearance. Additionally, the outside surface of the chamber is water cooled with continuous stainless steel cooling channels welded in a web-like pattern to provide an efficient heat sink.

 

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