Nanoquest II Load Lock

Designed for clean room operation, the Nanoquest II keeps the etch module in the service area of the clean room. System components, such as shields and other serviceable items, are easily accessed in the service area. A double door etch module allows servicing from either side of the chamber. UHV design rules ensure that the etch module and load lock chamber achieve very low base pressures. High speed vacuum pumps not only provide a fast pump down, but also reduce ion beam gas collisions.

Intlvac's Nanoquest II Ion Beam Etching System combines a water-cooled, rotating stage, a 22cm RF ion source, an easily accessible stainless steel vacuum chamber, cryogenic high vacuum pumping system, automatic pump down and venting, atmosphere to high vacuum gauging, mass flow controllers, chamber cabinet, and electronic control console.

Load Lock System
The Nanoquest II load lock system uses a magnetically coupled rotary linear drive to safely transport a wafer, that has been mounted to a carrier platen, into the etch chamber. A remote video viewing system allows the carrier to be monitored during the transfer, from the clean room side of the system.

The load lock enables the user to achieve faster etch turn around times, greater run to run repeatability, and reduces generation of particulates. Water vapor is practically eliminated in the UHV design along with process variability caused by fluctuations in room humidity.

High Performance

The Nanoquest comes supplied with 150mm and 100mm wafer platens for batch loading configuration with carbon masks for smaller sized wafers. With uniformity of ± 3% over a 100mm diameter, and a repeatability of ± 2% wafer to wafer, the Nanoquest is the ideal platform for your process.

 

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