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Nanoquest I R&D Ion Beam Etching System
 The Intlvac, Nanoquest I ion beam etching system is an idea plaform for etching single wafer substrate up to 4". Configured with a high cooling flow substrate stage, the system can etch through a photo resist mask to produce patterned substrates on any material. The unique design of the stage allows it to rotate and tilt the substrate during etching and maintain cooling while still under high vacuum Substrates are bonded onto the stage surface without the use of tape or greases.
 The
system is housed in a compact one-piece frame with integral electronics
rack to minimize lab or clean room space. High vacuum design principles
ensure quick cycle times and low ultimate pressure performance.
UHP Gas distribution ensures stable ion source operation.
 The chamber is a 14” diameter, 14” long cylinder with
a hinged front door and welded stainless steel cooling passages.
Substrate stage is door mounted. Stainless steel frame with integral
instrument rack. Rack mounted touch screen PLC control for automated:
pump down, pressure control, gas flow control, and ion source
operation.
Please click the links below to see some of Intlvac’s Nanoquest
systems in the field
> Download
PDF of Nanoquest R&D Brochure.
> Download
Adobe Acrobat Reader
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