OLED System : Dual Chamber Evaporator

Dual Chamber Thermal Vacuum Evaporation and Electron Beam Evaporation System

Intlvac’s OLED System is designed for dual chamber evaporation in a high vacuum loadlock with material handling in an atmosphere-controlled glovebox.

The first chamber is capable of evaporating by resistance evaporation from six different evaporation sources. A very high level of controlled evaporation is possible for materials that are temperature sensitive through a closed loop control system. The system allows co-deposition between one pair of Low Temperature Evaporation Sources designed for OLEDs, co-evaporation allows material mixing (four OLED sources in total). One pair of evaporation sources has special shielding to allow for high temperature thermal evaporation of platinum and other metals.

The second chamber is configured for co-evaporation between two 15cc single pocket electron beam guns with a gridless and filamentless ion source that provides an oxygen ion beam for assist.

Click to view larger image

The loadlocks have a fixture for holding one 6” wafer, or flat pieces of glass. A water cooled substrate holder made from OFHC copper is held in a 12” “squashed” half sphere chamber. The top chamber is on a hinge assembly and moves 180 degrees when opened to allow substrate mounting. Substrates such are full sized 150mm/6” wafers or smaller.