Indium films find various applications due to their unique properties. Some common applications include quantum computing, focal plane arrays, low-resistance ohmic contact for III-V and II-IV materials, and fabrication of electronic components in semiconductor industries.
The Intlvac Icarus Indium Solder Bump Deposition System is optimized for high throughput production with low maintenance and quick turnaround on parts. From pushing the "go" button to pulling out a finished 200 mm wafer takes less than 90 minutes making it ideal for high-volume markets.
The Icarus Indium Deposition System has the capacity of hundreds of depositions without the need to open the main chamber. When it is time to refill the indium, it only takes a few minutes to exchange the empty indium crucible with one that is pre-charged.