Indium is a ductile metal with a melting point of 156.6 °C, which is advantageous in microelectronics where lower processing temperatures are desired to prevent damage to the sensitive components. Indium's good thermal conductivity makes it suitable for applications where efficient heat dissipation is crucial such as semiconductor devices. The characteristics of indium, such as its thermal stability, and compatibility with complex crystal structures make it a valuable material for forming reliable and high-performance electrical contacts in semiconducter devices. 

The negative photoresist is preferred for the lift-off process since it generally offers higher selectivity, which means they are less likely to be dissolved or affected during subsequent processing steps. Negative photoresists simplify the lift-off process and allow for the deposition of the additional layers without adversely affecting the existing pattern.

Icarus Indium Coating Service

The indium films deposited with Icarus exhibit high-quality morphology of the film such as:

• Spit-free up to 70 Å/s on a 200mm wafer, small-grained, textured film structure due to low deposition temperature
• High uniformity (<5% over an 8" wafer)
• High yield of lift-off process due to the collimated flux that prevents coating on side walls
• 5-micron feature size and 10-micron pixel pitch
• Good indium fill and high yield on shape and size of the bump array (square and round)