Mark II+ Radiantly Cooled Ion Source

Gridless End-Hall Ion Source with Filament Cathode
Radiantly Cooled - Industrial Vacuum Applications

The Mark II⁺ Radiantly Cooled Ion Source is a gridless end-Hall ion source designed for industrial vacuum processing applications requiring high current density and low ion beam energies. Its robust stainless steel construction and radiant cooling design eliminate the need for water cooling while providing stable operation for precleaning and ion-assisted deposition processes. The source operates with a filament cathode and magnetic confinement to generate a broad, neutralized ion beam with mean ion energies suitable for surface modification, cleaning, and film property enhancement.

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Mark II⁺ Ion Source – Radiantly or Water-Cooled Configuration

Key Features

Gridless End-Hall design

Reduced contamination sensitivity
No grids to erode or replace

Radiant cooling

No external water cooling required

High beam current capability

Up to ~1–2 A ion beam current (gas dependent)

Low energy operation

Mean ion energy ≈ 60–80% of anode voltage

Self-neutralizing beam / Industrial robustness

Additional adjustable neutralization current
Stainless steel construction
Gold-plated hardware for reliable electrical contact

Applications

The Mark II⁺ enhances thin film process performance in:

Low energy ion beam precleaning
Ion-assisted deposition (IAD)
Surface activation

Film densification and adhesion improvement
Reactive processing with oxygen or nitrogen

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Technical Specifications

Parameter

Specification

Maximum continuous discharge power

900 W

Anode voltage (VA)

~50–300 V (argon, original design)

~110–300 V (oxygen, original design)

Low voltage option

Argon: ~40–300 V

Oxygen: ~90–300 V

Anode current (IA)

~1–5 A @ 180 V

~1–3 A @ 300 V (power limited)

Mean ion energy

30–180 eV (≈60% of VA setpoint)

Maximum ion beam current

~1–2 A (argon/oxygen dependent)

Neutralization current

5–20% of IA (typical)

Parameter

Requirement

Base pressure (recommended)

≤ 1 × 10⁻⁴ Torr

Operating pressure

0.5–1.0 × 10⁻³ Torr

Maximum operating pressure

1 × 10⁻³ Torr

Recommended pumping speed

≥ 700 L/s

Gas types

Argon, Oxygen, Nitrogen, inert gases

Gas purity

≥ 99.999%

Gas flow range

5–100 sccm

Parameter

Value

Cooling method

Radiant (no water cooling required)

Cathode type

Hot filament

Dimensions (L × Ø)

111 mm × 140 mm (4.4 in × 5.5 in)

Weight (source only)

5.9 kg (13 lb)

Mount footprint

7.4 in (189 mm)

Mount bolt circle

6.3 in (160 mm)

Component

Typical Service Interval

Filament cathode

7–10 hours (power dependent)

Gas distributor

30–600 hours (material/gas dependent)

Anode cleaning

100–150 hours

Body cleaning

200–300 hours

Operating Principle

The Mark II⁺ generates a low-pressure plasma (typically 0.1–1.0 mTorr) between a filament cathode and an angled anode within a cusped magnetic field. Ions are accelerated by a plasma space potential (not electrostatic grids), producing:

Broad angular ion beam
Mean ion energy ≈ 60–80% of anode voltage
Total ion beam current ≈ 20–30% of discharge current (argon/oxygen)

Beam Characteristics (Representative Performance)

Measured at R = 30 cm from source face:

Broad angular distribution
Current density increases with:

Higher anode current
Moderate anode voltage

Total integrated beam current:

≈ 20–30% of IA (original design)
≈ 15–25% of IA (low voltage option)

Thermal Characteristics

Radiant cooling only
Surface temperature may exceed 300°C after operation
Recommended cool-down period required before servicing

Controller Compatibility

Designed for use with Mark II Controller
Automatic control of:
- Anode voltage
- Anode current
- Gas flow (via MFC)
- Neutralization current

Optional Configuration

Low Voltage Option

Reduced beam energy
Lower gas flow operation
Lower beam current at equivalent power
Recommended for delicate substrate processing

Why Choose Intlvac Thin Film?

Intlvac Thin Film systems are built for precision coating, research flexibility, and industrial reliability. The Mark I⁺ Ion Source integrates seamlessly into: