Electra-UHV Sputtering Deposition System

The Electra UHV Sputtering System by Intlvac is a compact, purpose-built platform engineered for advanced thin film deposition in ultra-high vacuum (UHV) environments, achieving base pressures in the 10⁻¹⁰ Torr range. Designed for precision and flexibility, the Electra is ideal for prototyping and research & development of cutting-edge materials.

Equipped with Intlvac’s proprietary LabVIEW-based controller, the Electra enables automated sputtering of magnetic metals and insulating materials. The system is fully customizable to meet a wide range of material and process requirements.

The Electra-M variant includes a load-lock system for pre-loading and degassing single or multiple substrates, supporting high-throughput workflows and reducing contamination risks.

Electra-UHV Sputtering Deposition System

The Electra UHV Sputtering System by Intlvac is a compact, purpose-built platform engineered for advanced thin film deposition in ultra-high vacuum (UHV) environments, achieving base pressures in the 10⁻¹⁰ Torr range. Designed for precision and flexibility, the Electra is ideal for prototyping and research & development of cutting-edge materials.

Equipped with Intlvac’s proprietary LabVIEW-based controller, the Electra enables automated sputtering of magnetic metals and insulating materials. The system is fully customizable to meet a wide range of material and process requirements.

The Electra-M variant includes a load-lock system for pre-loading and degassing single or multiple substrates, supporting high-throughput workflows and reducing contamination risks.

Key Applications
  • MRAM development
  • Metallization processes
  • Crystal growth research
  • Oxide and nitride film deposition
  • Magnetic material prototyping
System Specifications
  • Compact ‘D’-shaped clamshell chamber
  • Up to 6 × 2” magnetron sputter sources
  • Base pressure < 5 × 10⁻⁹ Torr
  • Accommodates substrates up to 100 mm wafers
  • Substrate temperature up to 800°C
System Features
  • UHV base pressures with rapid pump-down via load-lock
  • Growth of amorphous or crystalline films
  • Substrate rotation, heating (800°C), or cooling with optional bias
  • Rotating substrate holder for high-temperature stability
  • Configurable with ion assist sources
  • Supports sequential or co-deposition
  • Compatible with 100 mm wafers and smaller carriers
  • Available in sputtering and evaporation configurations

Physical Vapor Deposition Options

  • Magnetron Sputtering: RF, DC, or Pulsed DC
  • Ion Source: For substrate cleaning or assist during film growth
  • Load-lock chamber with magnetic manipulator for 100 mm wafer transfers
  • Customizable substrate fixtures: single, multiple, planetary, or specialized designs

Precision Coating, Proven Performance

With decades of expertise in thin film technology, Intlvac’s Electra UHV platform offers the purity, control, and reliability demanded by today’s most advanced research and fabrication facilities.

thinfilm@intlvac.com | 1.800.959.5517

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