Mark II End-Hall Ion Source

Industry-Standard Ion Assistance for Optical Coating Systems 

The Intlvac Mark II End-Hall Ion Source is the industry-standard ion assist source for optical coating systems and remains one of the most widely used ion sources in production environments. Designed for medium to large vacuum chambers, the Mark II provides stable, high-current ion assistance for densification, surface preparation, and reactive processing. Its production-proven architecture, reactive gas compatibility, and configurable neutralization options make it suitable for both high-throughput manufacturing and advanced thin film development.


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Mark I+ Ion Source

Mark II - Ion Source  

Mark II End-Hall Ion Source

 Industry-Standard Ion Assistance for Optical Coating Systems 

 The Intlvac Mark II End-Hall Ion Source is the industry-standard ion assist source for optical coating systems and remains one of the most widely used ion sources in production environments. Designed for medium to large vacuum chambers, the Mark II provides stable, high-current ion assistance for densification, surface preparation, and reactive processing. Its production-proven architecture, reactive gas compatibility, and configurable neutralization options make it suitable for both high-throughput manufacturing and advanced thin film development.


Shop      
 Download Brochure     View Diagram  
Mark I+ Ion Source

Mark II - Ion Source 

Key Features


Production-Proven Design
  • Widely deployed in optical coating systems
  • Stable and repeatable beam performance
  • Designed for rigorous production environments
Reactive Gas Compatible

  • Suitable for oxygen and other reactive gases
  • Configurable for extended reactive processes
Low Contamination Operation
  • Gridless architecture reduces particulate sources
  • Optional filamentless configuration (HCES)
Configurable Platform
  • Multiple cathode/neutralizer options
  • Water-cooled configuration available
  • Numerous system integration options

Applications

  The Mark II supports:

  •  Optical coating densification
  • Ion-assisted deposition (IAD)
  • Reactive oxygen processing
  •  Substrate surface activation
  • Pre-deposition cleaning
  • Medium to large chamber coating systems

Applications

The Mark II supports:

  • Optical coating densification
  • Ion-assisted deposition (IAD)
  • Reactive oxygen processing
  • Substrate surface activation
  • Pre-deposition cleaning
  • Medium to large chamber coating systems

Technical Specifications


Parameter
Specification
Ion Energy
60 – 170 eV
Beam Current
Up to 1000 mA
Operating Pressure
< 3 × 10⁻⁴ Torr
Gas Requirements
10-50 sccm
Parameter
Specification
Source Dimensions (Dia. × Length)
14 cm × 19 cm
Chamber Size
60 – 150 cm
Throw Distance (Source-to-Substrate)
30 – 90 cm
Magnet
High-Curie point permanent
Cathode / Neutralizer
Immersed filament or HCES

Water-Cooled mark II Configuration

The Water-Cooled Mark II Ion Source incorporates enhanced thermal management for processes requiring reduced substrate temperatures and shorter production cycle times. A specialized anode design promotes efficient heat transfer away from the vacuum chamber and substrates.

Key Advantages

    • Dramatically reduced substrate temperatures
    • Elimination of cool-down prior to venting
    • Greater ion beam stability and control
    • Dramatically reduced substrate temperatures

Operational Results

    •  Reduced film stress
    • Increased production throughput
    • Improved reproducibility of film properties  


 Mark II - HCES Configuration 

The Mark II can be configured with a Hollow Cathode Electron Source (HCES) to support extended reactive gas operation while maintaining consistent ionization and beam neutralization.This configuration is particularly suited for oxygen-intensive and long-duration reactive processes.When combined with the water-cooled anode, the Mark II-HCES provides the lowest operating temperature within the Mark II series.

Benefits

    • Filamentless operation
    • Reduced contamination
    • Cooler source operation
    •  Extended run times in reactive environments


     System Integration

    The Mark II integrates into medium and large vacuum deposition systems, including

      • Optical coating platforms
      •  Production-scale ion-assisted deposition systems
      • Reactive gas processing chambers
      •  Large-area thin film tools

    Its gridless end-Hall configuration enables stable plasma generation and controlled ion delivery across larger throw distances, supporting uniform film densification and repeatable process performance in industrial vacuum environments.

      Water-Cooled mark II Configuration

      The Water-Cooled Mark II Ion Source incorporates enhanced thermal management for processes requiring reduced substrate temperatures and shorter production cycle times. A specialized anode design promotes efficient heat transfer away from the vacuum chamber and substrates.

      Key Advantages

        • Dramatically reduced substrate temperatures
        • Elimination of cool-down prior to venting
        • Greater ion beam stability and control
        • Dramatically reduced substrate temperatures

      Operational Results

        •  Reduced film stress
        • Increased production throughput
        • Improved reproducibility of film properties  

       Mark II - HCES Configuration 

      The Mark II can be configured with a Hollow Cathode Electron Source (HCES) to support extended reactive gas operation while maintaining consistent ionization and beam neutralization.This configuration is particularly suited for oxygen-intensive and long-duration reactive processes.When combined with the water-cooled anode, the Mark II-HCES provides the lowest operating temperature within the Mark II series.

      Benefits

        • Filamentless operation
        • Reduced contamination
        • Cooler source operation
        •  Extended run times in reactive environments

         System Integration

        The Mark II integrates into medium and large vacuum deposition systems, including

          • Optical coating platforms
          •  Production-scale ion-assisted deposition systems
          • Reactive gas processing chambers
          •  Large-area thin film tools

        Its gridless end-Hall configuration enables stable plasma generation and controlled ion delivery across larger throw distances, supporting uniform film densification and repeatable process performance in industrial vacuum environments.

          Why Choose Intlvac Thin Film?

          Intlvac Thin Film systems are built for precision coating, research flexibility, and industrial reliability. The Mark I⁺ Ion Source integrates seamlessly into:

          • Optical coating densification
          • Ion-assisted deposition (IAD)
          • Pre-deposition substrate cleaning
          • Surface activation

          We combine advanced plasma engineering with practical system design to deliver reproducible, high-quality thin films.

          Why Choose Intlvac Thin Film?

          Intlvac Thin Film systems are built for precision coating, research flexibility, and industrial reliability. The Mark I⁺ Ion Source integrates seamlessly into:

          • Optical coating densification
          • Ion-assisted deposition (IAD)
          • Pre-deposition substrate cleaning
          • Surface activation

          We combine advanced plasma engineering with practical system design to deliver reproducible, high-quality thin films.  

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