Mark II+ Radiantly Cooled Ion Source 

Gridless End-Hall Ion Source with Filament Cathode
Radiantly Cooled - Industrial Vacuum Applications  
The Mark II⁺ Radiantly Cooled Ion Source is a gridless end-Hall ion source designed for industrial vacuum processing applications requiring high current density and low ion beam energies. Its robust stainless steel construction and radiant cooling design eliminate the need for water cooling while providing stable operation for precleaning and ion-assisted deposition processes. The source operates with a filament cathode and magnetic confinement to generate a broad, neutralized ion beam with mean ion energies suitable for surface modification, cleaning, and film property enhancement.


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Mark I+ Ion Source

 Mark II⁺ Ion Source – Radiantly or Water-Cooled Configuration

Mark II+ Radiantly Cooled Ion Source 

Gridless End-Hall Ion Source with Filament Cathode
Radiantly Cooled - Industrial Vacuum Applications  
The Mark II⁺ Radiantly Cooled Ion Source is a gridless end-Hall ion source designed for industrial vacuum processing applications requiring high current density and low ion beam energies. Its robust stainless steel construction and radiant cooling design eliminate the need for water cooling while providing stable operation for precleaning and ion-assisted deposition processes. The source operates with a filament cathode and magnetic confinement to generate a broad, neutralized ion beam with mean ion energies suitable for surface modification, cleaning, and film property enhancement.


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 Mark II⁺ Ion Source – Radiantly or Water-Cooled Configuration

Key Features 


Gridless End-Hall design
  • Reduced contamination sensitivity
  • No grids to erode or replace
Radiant cooling

  • No external water cooling required
High beam current capability
  • Up to ~1–2 A ion beam current (gas dependent)
Low energy operation
  • Mean ion energy ≈ 60–80% of anode voltage
Self-neutralizing beam / Industrial robustness
  • Additional adjustable neutralization current
  • Stainless steel construction
  • Gold-plated hardware for reliable electrical contact

Applications

 The Mark II⁺ enhances thin film process performance in:

  •  Low energy ion beam precleaning
  •  Ion-assisted deposition (IAD)
  •  Surface activation
  •  Film densification and adhesion improvement
  • Reactive processing with oxygen or nitrogen

Applications

The Mark II⁺ enhances thin film process performance in:

  • Low energy ion beam precleaning
  • Ion-assisted deposition (IAD)
  • Surface activation
  • Film densification and adhesion improvement
  • Reactive processing with oxygen or nitrogen

Technical Specifications


Parameter
Specification
Maximum continuous discharge power
900 W
Anode voltage (VA)
~50–300 V (argon, original design)

~110–300 V (oxygen, original design)
Low voltage option
Argon: ~40–300 V

Oxygen: ~90–300 V
Anode current (IA)
~1–5 A @ 180 V

~1–3 A @ 300 V (power limited)
Mean ion energy
30–180 eV (≈60% of VA setpoint)
Maximum ion beam current
~1–2 A (argon/oxygen dependent)
Neutralization current
5–20% of IA (typical)
Parameter
Requirement
Base pressure (recommended)
≤ 1 × 10⁻⁴ Torr
Operating pressure
0.5–1.0 × 10⁻³ Torr
Maximum operating pressure
1 × 10⁻³ Torr
Recommended pumping speed
≥ 700 L/s
Gas types
Argon, Oxygen, Nitrogen, inert gases
Gas purity
≥ 99.999%
Gas flow range
5–100 sccm
Parameter
Value
Cooling method
Radiant (no water cooling required)
Cathode type
Hot filament
Dimensions (L × Ø)
111 mm × 140 mm (4.4 in × 5.5 in)
Weight (source only)
5.9 kg (13 lb)
Mount footprint
7.4 in (189 mm)
Mount bolt circle
6.3 in (160 mm)
Component
Typical Service Interval
Filament cathode
7–10 hours (power dependent)
Gas distributor
30–600 hours (material/gas dependent)
Anode cleaning
100–150 hours
Body cleaning
200–300 hours

Operating Principle

The Mark II⁺ generates a low-pressure plasma (typically 0.1–1.0 mTorr) between a filament cathode and an angled anode within a cusped magnetic field. Ions are accelerated by a plasma space potential (not electrostatic grids), producing:

  • Broad angular ion beam
  • Mean ion energy ≈ 60–80% of anode voltage
  • Total ion beam current ≈ 20–30% of discharge current (argon/oxygen)

Beam Characteristics (Representative Performance)

Measured at R = 30 cm from source face:

  • Broad angular distribution
  • Current density increases with:
    • Higher anode current
    • Moderate anode voltage
  • Total integrated beam current:
    • ≈ 20–30% of IA (original design)
    • ≈ 15–25% of IA (low voltage option)

Thermal Characteristics

  • Radiant cooling only
  • Surface temperature may exceed 300°C after operation
  • Recommended cool-down period required before servicing

Controller Compatibility

  • Designed for use with Mark II Controller
  • Automatic control of:
    • Anode voltage
    • Anode current
    • Gas flow (via MFC)
    • Neutralization current

Optional Configuration

Low Voltage Option

  • Reduced beam energy
  • Lower gas flow operation
  • Lower beam current at equivalent power
  • Recommended for delicate substrate processing

Why Choose Intlvac Thin Film?

Intlvac Thin Film systems are built for precision coating, research flexibility, and industrial reliability. The Mark II⁺ integrates seamlessly into:

  • Custom vacuum deposition systems
  • Optical coating platforms
  • R&D thin film tools
  • Production-scale coating systems

We combine advanced plasma engineering with practical system design to deliver reproducible, high-quality thin films.

Why Choose Intlvac Thin Film?

Intlvac Thin Film systems are built for precision coating, research flexibility, and industrial reliability. The Mark II⁺ integrates seamlessly into:

  • Custom vacuum deposition systems
  • Optical coating platforms
  • R&D thin film tools
  • Production-scale coating systems

We combine advanced plasma engineering with practical system design to deliver reproducible, high-quality thin films.   

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