Icarus Indium Solder Bump Deposition System

High-Throughput PVD Indium Coating for Semiconductor Applications

Engineered for Speed, Precision, and Reliability

The Intlvac Icarus Indium Solder Bump Deposition System is optimized for high-volume production, delivering rapid turnaround with exceptional repeatability. From the moment you press "start" to retrieving a fully processed 200 mm wafer takes less than 90 minutes, making Icarus a top-tier solution for demanding semiconductor manufacturing environments.

Icarus Indium Solder Bump Deposition System

High-Throughput PVD Indium Coating for Semiconductor Applications

Engineered for Speed, Precision, and Reliability

The Intlvac Icarus Indium Solder Bump Deposition System is optimized for high-volume production, delivering rapid turnaround with exceptional repeatability. From the moment you press "start" to retrieving a fully processed 200 mm wafer takes less than 90 minutes, making Icarus a top-tier solution for demanding semiconductor manufacturing environments.

Designed for Production Efficiency 

  • Extended Uptime: Capable of performing hundreds of depositions without opening the main vacuum chamber.
  • Quick Indium Refill: Fast and simple crucible exchange using pre-charged units minimizes downtime.
  • 2.5-Hour Turnaround: Full 4μm indium runs completed in under 2.5 hours.

Advanced Features

Superior Indium Film Quality — No "Spitting"

Intlvac has developed advanced methods to ultra-purify indium, eliminating the common issue of "spitting" during deposition. This results in high-purity, uniform coatings that are critical in microelectronic applications.

Thermal Bonding for Precise Temperature Control

Our system enables precise temperature management from +60°C to -75°C via thermal bonding of the substrate to the sample stage. This ensures:

  • Excellent thermal contact
  • Uniform film deposition
  • Optimal adhesion and microstructure

Why PVD for Indium Deposition?

Compared to electroplating and other methods, Physical Vapor Deposition (PVD) offers:

  • Superior adhesion and uniformity
  • Greater density and purity of thin films
  • Controlled film thickness for demanding applications
  • Broad material compatibility

Precision Solder Bump Arrays

The Icarus system delivers consistent results in solder bump formation, with benefits including:
  • High yield lift-off thanks to collimated flux and minimal sidewall coating
  • Excellent shape and size conformity for both square and round bump arrays
  • Low-temperature deposition reduces crystal defects and improves shear strength

Indium in Microelectronic Devices

Indium’s low melting point (156.6°C) and excellent thermal conductivity make it ideal for:

  • Flip-chip bonding
  • Semiconductor packaging
  • Microprocessors and ICs
  • Applications requiring efficient heat dissipation and low-temperature processing

Ready for Your Fab Floor

Whether you're scaling up production or optimizing device reliability, the Icarus Indium Deposition System provides the performance, flexibility, and support your operation demands. Contact us to learn how Icarus can support your next generation of microelectronic devices.

Learn More

Icarus Indium Deposition

Read more about our Icarus Indium Deposition System

  • High deposition Rate
  • High Uniformity
  • High Process Temperature Control
  • High Lift-Off Yield
  • Superior Bump Arrays

The Intlvac Indium Solder Bump Deposition System is specifically designed for high-throughput production, offering minimal maintenance and rapid product turnaround. Leveraging Intlvac’s proprietary technology and over 30 years of experience in system manufacturing and coating services, this system ensures exceptional reliability and performance. Ideal for high-volume markets, it delivers completed 200 mm diameter wafers in under 120 minutes—from start to finish.

Explore our latest brochure to learn more about the Icarus Indium Solder Bump Deposition System.

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