Icarus Indium Solder Bump Deposition System

Sub-Micron Deposition for Semiconductor, Micro-LED, and Quantum Applications

Indium is a ductile metal with a melting point of around 156.6 °C, which is advantageous in microelectronics where lower processing temperatures are desired to prevent damage to the sensitive components. Indium’s good thermal conductivity makes it suitable for applications where efficient heat dissipation is crucial such as semiconductor devices. The characteristics of indium, such as its thermal stability, and compatibility with complex crystal structures make it a valuable material for forming reliable and high-performance electrical contacts in semiconductor, micro-LED, and quantum devices.

The Intlvac Icarus Indium Solder Bump Deposition System is optimized for high-volume production, delivering rapid turnaround with exceptional repeatability. From the moment you press "start" to retrieving a fully processed 200 mm wafer takes less than 90 minutes, making Icarus a top-tier solution for demanding semiconductor manufacturing environments.

Icarus Indium Solder Bump Deposition System

The World's Best Sub-Micron Indium Solder Bump Deposition Platform

The Intlvac Icarus Indium Solder Bump Deposition System is optimized for high-volume production, delivering rapid turnaround with exceptional repeatability. From the moment you press "start" to retrieving a fully processed 200 mm wafer takes less than 90 minutes, making Icarus a top-tier solution for demanding semiconductor manufacturing environments.

Designed for Production Efficiency

Extended Uptime: Capable of performing hundreds of depositions without opening the main vacuum chamber.
Quick Indium Refill: Fast and simple crucible exchange using pre-charged units minimizes downtime.
2.5-Hour Turnaround: Full 4μm indium runs completed in under 2.5 hours.

Advanced Features

Superior Indium Film Quality — No "Spitting"

Intlvac has developed advanced methods to ultra-purify indium, eliminating the common issue of "spitting" during deposition. This results in high-purity, uniform coatings that are critical in microelectronic applications.

The films are grown at cryogenic temperatures, which enhance shear strength and improve bump adhesion to the wafers. These low temperatures also prevent lateral atom migration on the substrate, promoting reinforced columnar crystalline growth.

Thermal Bonding for Precise Temperature Control

Our system enables precise temperature management from +60°C to -75°C via thermal bonding of the substrate to the sample stage. Indium thin film deposition at low temperatures:

Slows down kinetics of the crystal growth leading to more uniform films
Leads to a more controlled and uniform nucleation process
At very low temperatures, indium thin films may exhibit amorphous or fine-grained structures for specific applications, like flexible electronics or organic electronics

Why Long-Throw Evaporation for Indium Deposition?

Compared to electroplating and other methods, Long-Throw Evaporation offers:

Superior adhesion and uniformity
Greater density and purity of thin films
Controlled film thickness for demanding applications
Broad material compatibility

Precision Solder Bump Arrays

The Icarus system delivers consistent results in solder bump formation, with benefits including:

High yield lift-off thanks to collimated flux and minimal sidewall coating
Excellent shape and size conformity for both square and round bump arrays down to sub-micron levels
Low-temperature deposition reduces crystal defects and improves shear strength

Indium Films Around the World

Indium’s low melting point (156.6°C) and excellent thermal conductivity make it ideal for:

Quantum Computing
Flip-chip bonding
Semiconductor packaging
Microprocessors and ICs
Focal Plane Arrays
Low-resistance ohmic contact for III-V and II-IV materials,
Applications requiring efficient heat dissipation and low-temperature processing

Ready for Your Fab Floor

Whether you're scaling up production or optimizing device reliability, the Icarus Indium Deposition System provides the performance, flexibility, and support your operation demands. Contact us to learn how Icarus can support your next generation of microelectronic devices.

Learn More