Intlvac's Icarus system geometry ensures a very flat and uniform deposition front for superior 'lift-off' capability. From pushing the 'go' button to pulling out a finished wafer with 2u of spit-free coating takes less than 90 minutes.

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Indium Solder Bump Coating Services

High-Precision Thin Film Deposition for Advanced Microelectronic Applications

Intlvac Thin Film specializes in high-quality indium film deposition using advanced physical vapor deposition (PVD) techniques. Our process enables precise, clean, and high-performance coatings optimized for cutting-edge applications in quantum computing, focal plane arrays, low-resistance ohmic contacts, and semiconductor device fabrication.

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Why Indium?

Indium is a ductile metal with a low melting point of 156.6 °C, making it ideal for low-temperature microelectronic processes that avoid damage to sensitive components. Its excellent thermal conductivity and chemical compatibility with III-V and II-VI semiconductors make it an essential material for:

• High-performance electrical contacts
• Efficient heat dissipation in semiconductor devices
• Integration into complex crystal structures
• Robust interconnects in next-generation computing systems

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Advantages of PVD Indium Coatings

Compared to methods like electroplating, PVD deposition offers:

• Superior film adhesion and density
• Excellent thickness uniformity
• Minimal environmental variation effects
• Broader material compatibility
• Precise control over thickness and morphology

Films grown at cryogenic temperatures further enhance:

• Shear strength and adhesion
• Columnar crystalline growth
• Suppression of lateral atom migration

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Icarus Indium Coating System

Intlvac’s Icarus platform is purpose-built for high-throughput, high-precision indium film deposition. Our proprietary system is engineered to deliver industry-leading performance, reliability, and yield.

Key Performance Features

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  Spit-free deposition up to 70 Å/s on 200 mm wafers
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  High uniformity (<5%) across 8-inch wafers
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  Textured, small-grain morphology from low-temperature deposition
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  Excellent feature resolution:

  • 5-micron feature size
  • 10-micron pixel pitch
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  High lift-off process yield:

  • Collimated flux minimizes sidewall coating
  • Enables clean pattern definition and precise feature transfer
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  Shape-flexible bump arrays:

  • Consistent indium fill for both square and round geometries

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Lift-Off Process Optimization

We use negative photoresist for the lift-off process, offering:

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  Higher selectivity and process stability
• Resistance to solvent attack during metal deposition
• Clean lift-off edges and minimized bridging
• Reliable pattern preservation through additional processing steps

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Applications

Intlvac’s indium thin films are ideal for:

• Quantum computing interconnects
• Infrared focal plane arrays (FPAs)
• Flip-chip bump bonding
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  High-reliability ohmic contact formation

  • Sensitive optoelectronic packaging