Intlvac's Icarus system geometry ensures a very flat and uniform deposition front for superior 'lift-off' capability. From pushing the 'go' button to pulling out a finished wafer with 2u of spit-free coating takes less than 90 minutes.
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Indium Solder Bump Coating Services
High-Precision Thin Film Deposition for Advanced Microelectronic Applications
Intlvac Thin Film specializes in high-quality indium film deposition using advanced physical vapor deposition (PVD) techniques. Our process enables precise, clean, and high-performance coatings optimized for cutting-edge applications in quantum computing, focal plane arrays, low-resistance ohmic contacts, and semiconductor device fabrication.
Why Indium?
Indium is a ductile metal with a low melting point of 156.6 °C, making it ideal for low-temperature microelectronic processes that avoid damage to sensitive components. Its excellent thermal conductivity and chemical compatibility with III-V and II-VI semiconductors make it an essential material for:
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High-performance electrical contacts
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Efficient heat dissipation in semiconductor devices
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Integration into complex crystal structures
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Robust interconnects in next-generation computing systems
Advantages of PVD Indium Coatings
Compared to methods like electroplating, PVD deposition offers:
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Superior film adhesion and density
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Excellent thickness uniformity
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Minimal environmental variation effects
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Broader material compatibility
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Precise control over thickness and morphology
Films grown at cryogenic temperatures further enhance:
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Shear strength and adhesion
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Columnar crystalline growth
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Suppression of lateral atom migration
Icarus Indium Coating System
Intlvac’s Icarus platform is purpose-built for high-throughput, high-precision indium film deposition. Our proprietary system is engineered to deliver industry-leading performance, reliability, and yield.
Key Performance Features
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Spit-free deposition up to 70 Å/s on 200 mm wafers
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High uniformity (<5%) across 8-inch wafers
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Textured, small-grain morphology from low-temperature deposition
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Excellent feature resolution:
- 5-micron feature size
- 10-micron pixel pitch
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High lift-off process yield:
- Collimated flux minimizes sidewall coating
- Enables clean pattern definition and precise feature transfer
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Shape-flexible bump arrays:
- Consistent indium fill for both square and round geometries
Lift-Off Process Optimization
We use negative photoresist for the lift-off process, offering:
Applications
Intlvac’s indium thin films are ideal for: