Upcoming Events

Intlvac Thin Film to Exhibit Nanoquest Ion Beam Etch Systems at ISTFA 2025

Intlvac Thin Film is pleased to announce our participation in ISTFA 2025, the 51st International Symposium for Testing and Failure Analysis, taking place November 16–20 in Pasadena, California,

As the premier event for the microelectronics failure analysis community, ISTFA brings together leaders in semiconductor reliability, advanced packaging, and heterogeneous integration. Intlvac will be showcasing our Nanoquest series of Ion Beam Etch (IBE) systems, designed for high-precision material removal across a range of applications—from failure analysis to device development and packaging.

Our broad beam IBE platforms deliver superior etch uniformity, process control, and flexibility, making them ideal tools for addressing the complex challenges of next-generation microelectronics.

Visit our booth to explore how Intlvac’s ion beam technology can support your analytical and fabrication workflows in an era of rapidly evolving device architectures.

Intlvac Thin Film Attending SEMICON Europa 2025 – Let’s Connect in Munich

Intlvac Thin Film will be attending SEMICON Europa 2025, co-located with productronica, from November 18–21 in Munich, Germany. This year’s theme, Global Collaborations for European Economic Resilience, emphasizes the vital role of international partnerships in advancing innovation, sustainability, and security in the semiconductor industry.

While Intlvac will not be exhibiting, President Dino Deligiannis will be walking the show floor, accompanied by Max Wanninger of Novel Technology Transfer GmbH. They will be available to discuss Intlvac’s advanced thin film coating systems and ion beam etch platforms, as well as opportunities for collaboration across Europe.

📩 To schedule a meeting, please contact:
Dino Deligiannis – sales@intlvac.com
Max Wanninger – For inquiries in German: max.wanninger@novel-tec.de

We look forward to connecting with you at SEMICON Europa 2025!