Mark I+ Gridless Ion Source

Precision Ion Beam Processing for Advanced Thin Film Applications

The Intlvac Thin Film Mark I⁺ Ion Source is a compact, radiatively cooled, gridless end-Hall ion source designed to deliver stable, high-current ion beams for demanding vacuum thin film applications. Optimized for reliability and ease of integration, the Mark I⁺ provides exceptional beam stability, low ion energy operation, and reduced maintenance — making it ideal for industrial and R&D thin film systems.

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Mark I⁺ Ion Source – Compact Industrial Design

Key Features

Gridless Design

No fragile grids
Reduced erosion
Contamination tolerant
Long operational stability

Radiatively Cooled

No water cooling
Simpler integration

High Current Density

Mean ion energy: 50–180 eV
Excellent for surface activation and densification

Self-Neutralizing

Minimal substrate charging
Suitable for insulating substrates

Compact & Lightweight

68 mm length × 70 mm diameter
0.9 kg total weight
Flexible mounting orientation

Applications

The Mark I⁺ Ion Source enhances film quality and process control in:

Optical coating densification
Ion-assisted deposition (IAD)
Pre-deposition substrate cleaning
Surface activation

Reactive oxygen processing
Nitride formation
Adhesion improvement layers

Technical Specifications

Parameter

Specification

Anode Voltage

50–300 V (Ar)

100–300 V (O₂)

Anode Current

0.2 – 1.0 A

Continuous Power

200 W

Peak Power

300 W (≤60 min duty cycle)

Maximum Ion Beam Current: Up to 350 mA

Parameter

Requirement

Operating Pressure

0.1 – 1.0 mTorr

Base Pressure

≤ 1 × 10⁻⁴ Torr

Gas Flow

2 – 20 sccm

Gases

Ar, O₂, N₂, inert gases

Recommended Pumping Speed: ≥ 700 L/s

Parameter

Value

Cooling

Radiative

Cathode

0.015” Tungsten Filament

Dimensions

68 mm × 70 mm

Weight

0.9 kg

Gas Inlet

1/8" Swagelok

Mounting

10-32 UNF

Beam Characteristics & Thermal Performance

Broad angular distribution
20-40% Anode to Beam Current
Stable discharge across operation range
Designed for reproducible film growth
Peak operating temperature: 400–500°C
Typical cool-down (atmosphere): 90–120 minutes
No active cooling required

Designed for manageability

The modular architecture allows:

Rapid anode assembly replacement
Easy filament change
Reduced chamber downtime
Space anode exchange capability
Typical cool-down (atmosphere): 90–120 minutes

Typical maintenance intervals are process-dependent, with filament lifetimes ranging from 1–6 hours depending on operating power.

Why Choose Intlvac Thin Film?

Intlvac Thin Film systems are built for precision coating, research flexibility, and industrial reliability. The Mark I⁺ Ion Source integrates seamlessly into: