Nanochrome IV IBSD

The Nanochrome IV IBSD deposits on 250mm diameter substrates and smaller. It can be configured for load lock or batch open to air substrate loading. With its sputter up geometry, it brings premium, low particle PVD deposition capability to thin film fabrication. The technology sputters at low pressure metals & dielectrics without powered cathodes. It is equipped with a multi-target carousel, high speed rotational substrate stage, ion assist capability, QCM instrumentation and dynamic optical control instrumentation for optical applications. It produces coatings with high density, low particles, smooth and stable material properties.

Nanochrome IV IBSD

The Nanochrome IV IBSD deposits on 250mm diameter substrates and smaller. It can be configured for load lock or batch open to air substrate loading. With its sputter up geometry, it brings premium, low particle PVD deposition capability to thin film fabrication. The technology sputters at low pressure metals & dielectrics without powered cathodes. It is equipped with a multi-target carousel, high speed rotational substrate stage, ion assist capability, QCM instrumentation and dynamic optical control instrumentation for optical applications. It produces coatings with high density, low particles, smooth and stable material properties.

Key Features

  • HV/UHV-compatible process chamber
  • Gridded broad-beam ion sources
  • Water-cooled multi-target carousel
  • Rotating, heated substrate stage
  • Exceptional pumping speeds

Ion Beam Sputter Deposition

Ion beam sputter deposition (IBSD) is a technique in which the sputter target is positioned external to the plasma environment. A primary broad-beam ion source generates an internal plasma and directs an energetic ion beam (<1500 eV) at the sputter target. At the target surface, atoms and molecules are ejected with an energy and flux distribution shaped by the properties of the ion beam, the target material, and their geometrical orientation.

Advanced Features for a Seamless Experience


User Friendly Automation

The Nanochrome™ IV IBSD is a compact, fully automated ion beam sputtering system designed for the deposition of high-quality metal and dielectric thin films. Its HV/UHV-compatible electro-polished stainless steel chamber avoids outgassing issues common in aluminum chambers and supports exceptional base pressure performance. Paired with oil-free dry pumping and high-throughput options such as load-lock substrate handling, the system ensures a clean, stable vacuum environment ideal for both R&D and production.

Advanced Ion Source & Deposition Control

The system features a high current density gridded broad-beam ion source with energy ranges from 100 to 1500 eV, capable of using inert or reactive gases like oxygen and nitrogen. A neutralizer creates a quasi-neutral beam, enabling stable deposition on dielectrics. A secondary ion source is available for in-situ precleaning and ion beam-assisted deposition (IBAD), which enhances film density and enables sophisticated reactive processes. Precise angular control and indexing of a multi-target carousel allow for multi-layer structures with high repeatability.

Uniformity Engineering

A high-speed, azimuthal rotating substrate stage ensures exceptional film uniformity by averaging plume inconsistencies. The system supports passive and active thermal management, including IR heat lamps for temperature-controlled deposition. Full system automation includes pumpdown sequencing, recipe execution, and closed-loop process control. A user-friendly graphical interface provides access to live status, system diagnostics, and multi-layer recipe management, supporting consistent thin film growth with optional in-situ monitoring tools.

Ion Beam and Plasma Processing Technologies


Intlvac delivers advanced ion beam and plasma processing solutions for precision etching, thin film deposition, surface modification, and substrate cleaning. Each technology offers distinct performance advantages , from highly controlled, directional ion beam treatments to uniform plasma-based processing ,  enabling optimized results across a wide range of materials. Built on decades of vacuum engineering expertise, our systems are designed to meet the demanding requirements of aerospace, optics, semiconductor, and research applications. We work closely with customers to configure reliable, application-specific solutions for both R&D and production environments.

Our Core Processes
  • Ion Beam Etching (IBE) / Ion Beam Milling (IBM)
  • Chemically Assisted Ion Beam Etching (CAIBE)
  • Reactive Ion Beam Etching (RIBE) 
  • Ion Beam Trimming (IBT)
  • Ion Beam Sputtering  (IBS)



Ion Beam Sputtering (IBS)

Ion Beam Sputtering is a physical vapor deposition technique in which a directed ion beam sputters material from a target for controlled thin film growth. The low-pressure process environment supports dense film formation, excellent adhesion, and precise control of thickness and composition. Reactive gases may be introduced to deposit dielectric or compound materials with tailored properties.

Ion Beam Sputter Deposition

Explore our Latest Ion Beam Sputter Deposition Technology

  • Low-Pressure Deposition
  • Dense, Clean Films
  • User Friendly Automation
  • Advanced Ion Source & Deposition Control

The Nanochrome™ IV Ion Beam Sputter Deposition (IBSD) system is a physical vapor deposition method that utilizes a remote broad ion/plasma beam source aimed at a grounded (or floating) sputter target. Bombarding ions sputter material from the target, creating an atomic or molecular vapor flux that condenses onto a thin film substrate.

Download the latest brochure to learn more about our Nanochrome IV Ion Beam Sputter Deposition system.

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