Mark I End-Hall Ion Source


Compact Ion Assistance for Research and Pilot Production Systems

The Intlvac Mark I End-Hall Ion Source is designed for small research, development, and pilot production e-beam coating systems. Its compact footprint and stable gridless architecture make it well suited for systems requiring controlled ion assistance in limited chamber volumes. Engineered for rugged operation and low contamination performance, the Mark I provides reliable beam delivery for surface treatment and thin film modification processes in small to medium vacuum chambers.


Mark I+ Ion Source

Mark I - Ion Source 

Key Features


Reactive Gas Compatible
  • Supports reactive process environments
  • Suitable for oxygen and other reactive chemistries
Low Contamination Operation

  • Gridless construction minimizes particulate sources
  • Stable plasma generation with reduced debris
Rugged and Reliable Design
  • High-Curie point permanent magnet
  • Robust end-Hall architecture for long-term operation
Compact for Small Systems
  • Designed for chambers up to 60 cm
  • Ideal for research and pilot-scale platforms

Applications

 The Mark I is intended for:

  •  Small R&D e-beam coating systems
  • Pilot production coating platforms
  •  Ion-assisted deposition processes
  • Surface activation and film densification
  • Pre-deposition substrate treatment

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Technical Specifications


Parameter
Specification
Ion Energy
50–170 eV
Beam Current
Up to 200 mA
Operating Pressure
< 3 × 10⁻⁴ Torr
Gas Requirements
3–10 sccm
Parameter
Specification
Source Dimensions (Dia. × Length)
6.4 cm × 11.4 cm
Chamber Size
Up to 60 cm
Throw Distance (Source-to-Substrate)
Up to 30 cm
Magnet
High-Curie point permanent
Cathode / Neutralizer
Immersed filament or HCES

Operational Characteristics

The Mark I employs a gridless end-Hall discharge configuration to produce a controlled, low-energy ion beam suitable for delicate substrates and thin film growth processes. Its moderate beam current and compact geometry make it appropriate for systems where chamber space and pumping capacity are limited.The option of either an immersed filament or Hollow Cathode Electron Source (HCES) allows configuration flexibility depending on operational lifetime requirements and process sensitivity.

Why Choose Intlvac Thin Film?

Intlvac Thin Film systems are built for precision coating, research flexibility, and industrial reliability. The Mark I⁺ Ion Source integrates seamlessly into:

  • Optical coating densification
  • Ion-assisted deposition (IAD)
  • Pre-deposition substrate cleaning
  • Surface activation

We combine advanced plasma engineering with practical system design to deliver reproducible, high-quality thin films.

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