Ion Beam Etching and Milling

The Nanoquest II is a precision-engineered Ion Beam Etching (IBE) system developed to meet the stringent demands of advanced microfabrication, photonics, and materials research. Built on an ultra-high vacuum (UHV) platform with stainless steel construction and active thermal management, the Nanoquest II offers unparalleled stability, cleanliness, and process repeatability.

At its core is a 22 cm RF Inductively Coupled Plasma (ICP) gridded ion source, delivering ion energies from 100 to 1200 eV with beam currents exceeding 1 Amp. With its universal etching capability, the system excels at processing a wide variety of materials, including diamond, crystalline substrates such as silicon, silicon dioxide, titanium dioxide, quartz, glass, and lithium niobate, as well as all classes of metals.

The filamentless ionization design ensures long service life with minimal maintenance, while self-aligning ion optics provide highly uniform beam profiles and consistent process results.

Nanofabrication POWERHOUSE

  • Integrated Circuit delayering and cross-sectioning
  • MEMS fabrication and prototyping
  • Integrated circuit patterning
  • Lithium Niobate device etching

  • Josephson junction fabrication
  • Magnetic Tunnel Junction (MTJ) processing
  • Spintronic devices
  • Thin-film superconducting and magnetic structures

  • Waveguide fabrication and refinement
  • Slanted and surface relief grating structures
  • Laser facets
  • Photonic Integrated Circuits (PICs)

  • Sub-micron structure development
  • Prototype device fabrication
  • Advanced academic and industrial R&D
  • Complex multilayer pattern transfer

  • LED etching and structuring
  • Photodetector fabrication
  • Integrated optical circuit processing
  • Thin-film optoelectronic devices

  • High-resolution structural analysis
  • Compositional studies
  • Cross-sectional evaluation
  • Precision material thinning

Innovation at your Fingertips

Real time monitoring of etch material by SIMS
Real time monitoring of etch material by Secondary Ion Mass Spectrometry (SIMS).

Analytical Endpoint Detection Boosts Accuracy

The Nanoquest II can integrate an in-situ end point detection system based on Secondary Ion Mass Spectrometry (SIMS) to provide real-time monitoring of material removal during ion beam etching. By detecting sputtered species directly from the substrate surface, the system enables highly precise etch stops — even on ultra thin film stacks with ±5 Å resolution, heavily masked wafers, or small 5 mm × 5 mm samples.

Equipped with a triple-filter quadrupole mass spectrometer (300 amu range) and pulse-counting detector, the SIMS system delivers exceptional sensitivity and accuracy. Differential pumping maintains high-vacuum operation during etching at chamber pressures up to 0.5 mTorr.

A dedicated software interface displays real-time signal traces, allowing operators to identify layer transitions, terminate processes at the desired depth, and improve repeatability compared to conventional time- or power-based methods. The SIMS instrument can also function in Residual Gas Analysis (RGA) mode, supporting vacuum diagnostics and process characterization.

    Step into the Future of Photonics

    Intlvac's Lithium Niobate Foundry

    Available as a Cluster Tool, Individual Modules, or an In-House On-Demand Service.

    Nanoquest II IBE

    High Aspect-Ratio Etching

    Nanoquest II is a precision ion beam etching system designed for advanced R&D in photonic device fabrication. Using a broad-beam ion source and adjustable substrate motion, it enables smooth, uniform material removal across LiNbO₃ and other challenging materials. Its tunable energy control, in-situ cooling, and flexible masking options ensure exceptional etch quality, making it ideal for fabricating next-generation lithium niobate components.

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    Nanochrome IV PARMS

    Precision Oxide and Nitride Films

    Nanochrome™ IV uses Plasma Assisted Reactive Magnetron Sputtering (PARMS) to deposit dense, uniform oxide and nitride films essential for lithium niobate device fabrication. These coatings enable precise masking, passivation, and optical tuning while maintaining pristine material interfaces. Integrated within Intlvac’s cluster environment, Nanochrome IV ensures clean, repeatable processing for high-performance photonic and quantum applications.

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    Aegis DLC

    Hard Carbon Etch Masking

    Aegis DLC enables precision etching for LNOI waveguide fabrication through Plasma-Enhanced Chemical Vapor Deposition (PECVD) of a diamond-like carbon hardmask. Its high hardness, adhesion, and selectivity ensure accurate pattern transfer during ion beam etching, producing smooth, high-fidelity lithium niobate structures essential for advanced photonic and quantum devices.


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    Ion Beam and Plasma Processing Technologies


    Intlvac delivers advanced ion beam and plasma processing solutions for precision etching, thin film deposition, surface modification, and substrate cleaning. Each technology offers distinct performance advantages , from highly controlled, directional ion beam treatments to uniform plasma-based processing ,  enabling optimized results across a wide range of materials. Built on decades of vacuum engineering expertise, our systems are designed to meet the demanding requirements of aerospace, optics, semiconductor, and research applications. We work closely with customers to configure reliable, application-specific solutions for both R&D and production environments.

    Our core process technologies include:
    • Ion Beam Etching (IBE) / Ion Beam Milling (IBM)
    • Chemically Assisted Ion Beam Etching (CAIBE)
    • Reactive Ion Beam Etching (RIBE) 
    • Ion Beam Trimming (IBT)
    • Ion Beam Sputtering  (IBS)



    Ion Beam Etching (IBE) / Ion Beam Milling (IBM)

    Ion Beam Etching is a highly controlled physical sputtering process in which energetic ions are directed toward a substrate to achieve precise, anisotropic material removal. The broad, collimated ion beam ensures excellent uniformity across the substrate surface, while programmable substrate motion further enhances process consistency. The result is repeatable, chemistry-independent etching suitable for advanced thin film patterning and precision component fabrication.

    Other Systems

    • Nanoquest i
    • Nanoquest iii
    • Nanoquest Pico

    Chemically Assisted Ion Beam Etching (CAIBE)

    Chemically Assisted Ion Beam Etching introduces reactive gases directly at the substrate surface during ion bombardment. The localized chemical interaction increases material removal rates and enhances selectivity while maintaining directional control. CAIBE is particularly effective for compound materials and applications demanding tailored etch behavior.

    Other Systems

    • Nanoquest i
    • Nanoquest iii
    • Nanoquest Pico

    Reactive Ion Beam Etching (RIBE) 

    Reactive Ion Beam Etching combines physical ion bombardment with reactive species generated within the ion source. The simultaneous chemical and physical interaction enhances etch efficiency, improves selectivity, and enables refined feature definition. This approach is well suited for structured surfaces requiring controlled profiles and optimized throughput.

    Other Systems

    • Nanoquest i
    • Nanoquest iii
    • Nanoquest Pico

    Ion Beam Trimming (IBT)

    Ion Beam Trimming utilizes a finely defined ion beam to selectively remove material with nanometer-scale precision. Through controlled beam scanning and dwell time adjustment, material thickness can be tuned locally to achieve targeted device or performance characteristics. The process enables deterministic, high-accuracy corrections in advanced functional components.

    Other Systems
    • Nanoquest i
    • Nanoquest iii
    • Nanoquest Pico
    Ion Beam Etching and Milling

    Explore our Latest Ion Beam Etch Technology Solutions

    • Optimized and Flexible Design
    • Robust Chamber Options
    • High-Performance Vacuum & Ion Source
    • Precision Stage & Process Control
    • Automation, Data & Monitoring

    The Nanoquest II is the core system in Intlvac’s Nanoquest Suite of precision ion beam etching and milling tools, designed for advanced material modification and pattern transfer. Building on the compact Nanoquest Pico and Nanoquest I, it offers enhanced beam control, superior uniformity, and stable performance across metals, dielectrics, and semiconductors. Positioned between R&D and production-scale systems, the Nanoquest II delivers the ideal balance of flexibility, precision, and throughput for research and pilot manufacturing.

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    Colorado Photonics Industry Association American Precision Optics Manufacturing Association SPIE Corporate Member The Canadian Association of Defence and Security Industries Canadian Photonic Industry Consortium (CPIC)
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