Ion Beam Etching and Milling

The Nanoquest II is a precision-engineered Ion Beam Etching (IBE) system developed to meet the stringent demands of advanced microfabrication, photonics, and materials research. Built on an ultra-high vacuum (UHV) platform with stainless steel construction and active thermal management, the Nanoquest II offers unparalleled stability, cleanliness, and process repeatability.

At its core is a 22 cm RF Inductively Coupled Plasma (ICP) gridded ion source, delivering ion energies from 100 to 1200 eV with beam currents exceeding 1 Amp. With its universal etching capability, the system excels at processing a wide variety of materials, including diamond, crystalline substrates such as silicon, silicon dioxide, titanium dioxide, quartz, glass, and lithium niobate, as well as all classes of metals.

The filamentless ionization design ensures long service life with minimal maintenance, while self-aligning ion optics provide highly uniform beam profiles and consistent process results.

Nanofabrication POWERHOUSE

  • Integrated Circuit delayering and cross-sectioning
  • MEMS fabrication and prototyping
  • Integrated circuit patterning
  • Lithium Niobate device etching

  • Josephson junction fabrication
  • Magnetic Tunnel Junction (MTJ) processing
  • Spintronic devices
  • Thin-film superconducting and magnetic structures

  • Waveguide fabrication and refinement
  • Slanted and surface relief grating structures
  • Laser facets
  • Photonic Integrated Circuits (PICs)

  • Sub-micron structure development
  • Prototype device fabrication
  • Advanced academic and industrial R&D
  • Complex multilayer pattern transfer

  • LED etching and structuring
  • Photodetector fabrication
  • Integrated optical circuit processing
  • Thin-film optoelectronic devices

  • High-resolution structural analysis
  • Compositional studies
  • Cross-sectional evaluation
  • Precision material thinning

Innovation at your Fingertips

LabVIEW User Interface
Example of HMI user interface window for smart automation.

Human Machine Interface (HMI)

  • Touchscreen Control – 22” color flat-panel display with menu-driven navigation for recipe setup, process timing, and sequencing.
  • Real-Time Monitoring – Numerical and graphical presentation of operating parameters with continuous setpoint readback.
  • Data Logging – Every instruction, action, and parameter is recorded and stored with each run for full traceability.
  • User Access – Multi-tiered password protection uniquely identifies users and secures process data.
  • Automation – One-touch execution for pumpdown, gas flow, conditioning, etch cycles, and venting.
  • Process Flexibility – Full user access to process variables with closed-loop feedback stabilization for repeatable results.
  • Safety & Connectivity – Interlock chain prevents unsafe operation; EMO switches are positioned for immediate shutdown; Ethernet connectivity provides network accessibility.
  • Ready-to-Run – All software and hardware are fully installed, tested, and integrated for immediate use.
Step into the Future of Photonics

Intlvac's Lithium Niobate Foundry

Available as a Cluster Tool, Individual Modules, or an In-House On-Demand Service.

Nanoquest II IBE

High Aspect-Ratio Etching

Nanoquest II is a precision ion beam etching system designed for advanced R&D in photonic device fabrication. Using a broad-beam ion source and adjustable substrate motion, it enables smooth, uniform material removal across LiNbO₃ and other challenging materials. Its tunable energy control, in-situ cooling, and flexible masking options ensure exceptional etch quality, making it ideal for fabricating next-generation lithium niobate components.

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Nanochrome IV PARMS

Precision Oxide and Nitride Films

Nanochrome™ IV uses Plasma Assisted Reactive Magnetron Sputtering (PARMS) to deposit dense, uniform oxide and nitride films essential for lithium niobate device fabrication. These coatings enable precise masking, passivation, and optical tuning while maintaining pristine material interfaces. Integrated within Intlvac’s cluster environment, Nanochrome IV ensures clean, repeatable processing for high-performance photonic and quantum applications.

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Aegis DLC

Hard Carbon Etch Masking

Aegis DLC enables precision etching for LNOI waveguide fabrication through Plasma-Enhanced Chemical Vapor Deposition (PECVD) of a diamond-like carbon hardmask. Its high hardness, adhesion, and selectivity ensure accurate pattern transfer during ion beam etching, producing smooth, high-fidelity lithium niobate structures essential for advanced photonic and quantum devices.


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Ion Beam and Plasma Processing Technologies


Intlvac delivers advanced ion beam and plasma processing solutions for precision etching, thin film deposition, surface modification, and substrate cleaning. Each technology offers distinct performance advantages , from highly controlled, directional ion beam treatments to uniform plasma-based processing ,  enabling optimized results across a wide range of materials. Built on decades of vacuum engineering expertise, our systems are designed to meet the demanding requirements of aerospace, optics, semiconductor, and research applications. We work closely with customers to configure reliable, application-specific solutions for both R&D and production environments.

Our core process technologies include:
  • Ion Beam Etching (IBE) / Ion Beam Milling (IBM)
  • Chemically Assisted Ion Beam Etching (CAIBE)
  • Reactive Ion Beam Etching (RIBE) 
  • Ion Beam Trimming (IBT)
  • Ion Beam Sputtering  (IBS)



Ion Beam Etching (IBE) / Ion Beam Milling (IBM)

Ion Beam Etching is a highly controlled physical sputtering process in which energetic ions are directed toward a substrate to achieve precise, anisotropic material removal. The broad, collimated ion beam ensures excellent uniformity across the substrate surface, while programmable substrate motion further enhances process consistency. The result is repeatable, chemistry-independent etching suitable for advanced thin film patterning and precision component fabrication.

Other Systems

  • Nanoquest I
  • Nanoquest III
  • Nanoquest Pico

Chemically Assisted Ion Beam Etching (CAIBE)

Chemically Assisted Ion Beam Etching introduces reactive gases directly at the substrate surface during ion bombardment. The localized chemical interaction increases material removal rates and enhances selectivity while maintaining directional control. CAIBE is particularly effective for compound materials and applications demanding tailored etch behavior.

Other Systems

  • Nanoquest I
  • Nanoquest III
  • Nanoquest Pico

Reactive Ion Beam Etching (RIBE) 

Reactive Ion Beam Etching combines physical ion bombardment with reactive species generated within the ion source. The simultaneous chemical and physical interaction enhances etch efficiency, improves selectivity, and enables refined feature definition. This approach is well suited for structured surfaces requiring controlled profiles and optimized throughput.

Other Systems

  • Nanoquest I
  • Nanoquest III
  • Nanoquest Pico

Ion Beam Trimming (IBT)

Ion Beam Trimming utilizes a finely defined ion beam to selectively remove material with nanometer-scale precision. Through controlled beam scanning and dwell time adjustment, material thickness can be tuned locally to achieve targeted device or performance characteristics. The process enables deterministic, high-accuracy corrections in advanced functional components.

Other Systems
  • Nanoquest I
  • Nanoquest III
  • Nanoquest Pico
Ion Beam Etching and Milling

Explore our Latest Ion Beam Etch Technology Solutions

  • Optimized and Flexible Design
  • Robust Chamber Options
  • High-Performance Vacuum & Ion Source
  • Precision Stage & Process Control
  • Automation, Data & Monitoring

The Nanoquest II is the core system in Intlvac’s Nanoquest Suite of precision ion beam etching and milling tools, designed for advanced material modification and pattern transfer. Building on the compact Nanoquest Pico and Nanoquest I, it offers enhanced beam control, superior uniformity, and stable performance across metals, dielectrics, and semiconductors. Positioned between R&D and production-scale systems, the Nanoquest II delivers the ideal balance of flexibility, precision, and throughput for research and pilot manufacturing.

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